Coil electronic component

ABSTRACT

A coil electronic component includes: a magnetic body including first and second coil parts spaced apart from each other, wherein the coil parts each include first and second coil conductors respectively disposed on first and second surfaces of a substrate, and a non-magnetic film disposed between the first and second coil parts.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of priority to Korean PatentApplication No. 10-2015-0189255, filed on Dec. 30, 2015 with the KoreanIntellectual Property Office, the entirety of which is incorporatedherein by reference.

BACKGROUND

The present disclosure relates to a coil electronic component.

An inductor, which is a type of coil electronic component, is arepresentative passive element that maybe used to configure anelectronic circuit together with a resistor and a capacitor to removenoise.

In order to reduce a mounting area of passive elements mounted on aprinted circuit board, an array type inductor in which a plurality ofcoil parts are disposed in a coil may be used.

SUMMARY

An aspect of the present disclosure provides a coil electronic componentcapable of suppressing harmful mutual interference of magnetic fluxoccurring from a plurality of coil parts disposed in a coil.

According to an aspect of the present disclosure, a coil electroniccomponent includes a magnetic body in which coil parts formed byconnecting coil conductors disposed on one surface and the other surfaceof a substrate are embedded, wherein the magnetic body includes firstand second coil parts disposed to be spaced apart from each other, and anon-magnetic film disposed between the first and second coil parts.

According to another aspect of the present disclosure, a coil electroniccomponent includes a magnetic body in which coil parts formed byconnecting coil conductors disposed on one surface and the other surfaceof a substrate are embedded, wherein the magnetic body includes firstand second coil parts disposed to be spaced apart from each other, and agap part disposed between the first and second coil parts, andsuppressing mutual interference of magnetic flux occurring from thefirst and second coil parts.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view of a coil electronic component according toan exemplary embodiment in the present disclosure;

FIG. 2 is a perspective view illustrating a coil electronic componentaccording to an exemplary embodiment in the present disclosure so thatcoil parts of the coil electronic component are visible;

FIG. 3A is an inner projection plan view when being viewed from adirection A of FIG. 2, and FIG. 3B is an inner projection plan view whenbeing viewed from a direction B of FIG. 2;

FIG. 4 is a cross-sectional view taken along line I-I′ of FIG. 1;

FIG. 5A is a view illustrating magnetic flux formed in a coil electroniccomponent in which a non-magnetic film is not disposed, according to therelated art, and FIG. 5B is a view illustrating magnetic flux formed ina coil electronic component according to an exemplary embodiment in thepresent disclosure;

FIG. 6 is a plan view illustrating a pattern shape of coil parts of thecoil electronic component of FIG. 1; and

FIG. 7 is a perspective view illustrating a figure in which the coilelectronic component of FIG. 1 is mounted on a printed circuit board(PCB).

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

Throughout the specification, it will be understood that when anelement, such as a layer, region or wafer (substrate), is referred to asbeing “on,” “connected to,” or “coupled to” another element, it can bedirectly “on,” “connected to,” or “coupled to” the other element orother elements intervening therebetween may be present. In contrast,when an element is referred to as being “directly on,” “directlyconnected to,” or “directly coupled to” another element, there may be noother elements or layers intervening therebetween. Like numerals referto like elements throughout. As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.

It will be apparent that though the terms first, second, third, etc. maybe used herein to describe various members, components, regions, layersand/or sections, these members, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one member, component, region, layer or section fromanother region, layer or section. Thus, a first member, component,region, layer or section discussed below could be termed a secondmember, component, region, layer or section without departing from theteachings of the exemplary embodiments.

Spatially relative terms, such as “above,” “upper,” “below,” and “lower”and the like, may be used herein for ease of description to describe oneelement's relationship relative to another element(s) as shown in thefigures. It will be understood that the spatially relative terms areintended to encompass different orientations of the device in use oroperation in addition to the orientation depicted in the figures. Forexample, if the device in the figures is turned over, elements describedas “above,” or “upper” relative to other elements would then be oriented“below,” or “lower” relative to the other elements or features. Thus,the term “above” can encompass both the above and below orientationsdepending on a particular direction of the figures. The device may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein may be interpretedaccordingly.

The terminology used herein describes particular embodiments only, andthe present disclosure is not limited thereby. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willbe further understood that the terms “comprises,” and/or “comprising”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, members, elements, and/or groupsthereof, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, members, elements, and/orgroups thereof.

Hereinafter, embodiments of the present disclosure will be describedwith reference to schematic views illustrating embodiments of thepresent disclosure. In the drawings, for example, due to manufacturingtechniques and/or tolerances, modifications of the shape shown may beestimated. Thus, embodiments of the present disclosure should not beconstrued as being limited to the particular shapes of regions shownherein, for example, to include a change in shape results inmanufacturing. The following embodiments may also be constituted by oneor a combination thereof.

The contents of the present disclosure described below may have avariety of configurations and propose only a required configurationherein, but are not limited thereto.

Coil Electronic Component

Hereinafter, a coil electronic component according to an exemplaryembodiment in the present disclosure, in particular a thin film typeinductor, will be described. However, the present disclosure is notlimited thereto.

FIG. 1 is a perspective view of a coil electronic component according toan exemplary embodiment in the present disclosure, and FIG. 2 is aperspective view illustrating a coil electronic component according tothe exemplary embodiment so that coil parts of the coil electroniccomponent are visible.

Referring to FIGS. 1 and 2, as an example of a coil electroniccomponent, a thin film type inductor used in a power line of a powersupply circuit is disclosed.

A coil electronic component 100 according to the exemplary embodimentmay include a magnetic body 50, first and second coil parts 41 and 42embedded in the magnetic body 50, a non-magnetic film 61 disposedbetween the first and second coil parts 41 and 42, and first to fourthexternal electrodes 81, 82, 83, and 84 disposed on outer surfaces of themagnetic body 50.

In the exemplary embodiment, defined terms referred to as “first,”“second,” and “first to fourth” are used merely to distinguish theobject, and are not limited to the above-mentioned order.

In the coil electronic component 100 according to the exemplaryembodiment, a “length direction” refers to an “L” direction of FIG. 1, a“width direction” refers to a “W” direction of FIG. 1, and a “thicknessdirection” refers to a “T” direction of FIG. 1.

The magnetic body 50 may include first and second end surfaces S_(L1)and S_(L2) opposing each other in a length L direction of the magneticbody 50, first and second side surfaces S_(W1) and S_(W2) connecting thefirst and second end surfaces S_(L1) and S_(L2) and opposing each otherin a width W direction of the magnetic body 50, and first and secondmain surfaces S_(T1) and S_(T2) opposing each other in a thickness Tdirection of the magnetic body 50.

The magnetic body 50 may include any material without being limited aslong as the material exhibits magnetic properties. For example, themagnetic body 50 may include a ferrite or a metallic magnetic powder.

The ferrite may be, for example, an Mn—Zn based ferrite, a Ni—Zn basedferrite, a Ni—Zn—Cu based ferrite, an Mn—Mg based ferrite, a Ba-basedferrite, a Li-based ferrite, or the like.

The magnetic metallic powder may be a crystalline or amorphous metalincluding any one or more selected from the group consisting of iron(Fe), silicon (Si), boron (B), chromium (Cr), aluminum (Al), copper(Cu), niobium (Nb), and nickel (Ni).

For example, the magnetic metallic powder may be an Fe—Si—B—Cr basedamorphous metal.

The magnetic metallic powder may be included in a form in which it isdispersed in a thermosetting resin such as an epoxy resin, polyimide, orthe like.

The magnetic body 50 may include the first and second coil parts 41 and42 disposed to be spaced apart from each other.

That is, the coil electronic component 100 according to the exemplaryembodiment may have a basic structure of an inductor array type in whichtwo or more coil parts are disposed in the same coil.

The first and second coil parts 41 and 42 may be formed by connectingfirst coil conductors 43 and 45 respectively formed on a first surfaceof each of first and second substrates 21 and 22 disposed to be spacedapart from each other in the magnetic body 50 and second coil conductors44 and 46 respectively formed on a second surface of each of thesubstrates 21 and 22 opposing the first surface of each of thesubstrates 21 and 22.

Each of the first and second coil conductors 43, 44, 45, and 46 may havea planar coil form formed on the same plane of the first and secondsubstrates 21 and 22.

The first and second coil conductors 43, 44, 45, and 46 may be formed ina spiral shape, and the first and second coil conductors 43, 44, 45, and46 formed on the first and second surfaces of the substrates 21 and 22may be electrically connected to each other through a via (notillustrated) formed to penetrate through the substrates 21 and 22.

The first and second coil conductors 43, 44, 45, and 46 maybe formed byperforming electroplating on the substrates 21 and 22, but are notlimited thereto.

The first and second coil conductors 43, 44, 45, and 46 and the via maybe formed of a metal having excellent electrical conductivity, and maybe formed of, for example, silver (Ag), palladium (Pd), aluminum (Al),nickel (Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt),alloys thereof, or the like.

The first and second coil conductors 43, 44, 45, and 46 may be coatedwith an insulating layer (not illustrated) so as not to directly be incontact with a magnetic material forming the magnetic body 50.

The first and second coil parts 41 and 42 may be disposed in asymmetrical shape in relation to a central portion of the magnetic body50 in the length L direction thereof.

The first and second substrates 21 and 22 may be formed of, for example,a polypropylene glycol (PPG) substrate, a ferrite substrate, a metalbased soft magnetic substrate, or the like.

A central portion of the first and second substrates 21 and 22 may bepenetrated to form a through hole, and the through hole may be filledwith the magnetic material to form first and second core parts 51 and52. That is, the first and second core parts 51 and 52 may be formed ininner portions of the first and second coil parts 41 and 42,respectively.

As the first and second core parts 51 and 52 filled with the magneticmaterial are formed in the inner portions of the first and second coilparts 41 and 42, inductance L may be improved.

The first and second coil parts 41 and 42 may be disposed to be spacedapart from each other by a predetermined distance in the length Ldirection of the magnetic body 50, and the non-magnetic film 61 may bedisposed between the first and second coil parts 41 and 42.

The non-magnetic film 61 may be disposed between the first and secondcoil parts 41 and 42, and may be disposed while being in contact withthe first and second side surfaces S_(W1) and S_(W2) of the magneticbody 50 in the width W direction of the magnetic body 50.

Further, the non-magnetic film 61 maybe disposed while being in contactwith the first and second main surfaces S_(T1) and S_(T2) of themagnetic body 50 opposing each other in a thickness T direction of themagnetic body 50.

According to an exemplary embodiment, by forming the non-magnetic film61 between the first and second coil parts 41 and 42, harmful mutualinterference of magnetic flux occurring from a plurality of coil partsmay be suppressed.

When a coil electronic component of an array type in which the pluralityof coil parts are disposed in the coil, malfunctioning of the productmay occur and efficiency may be deteriorated due to harmful interferencebetween the coil parts.

Further, as the coil electronic component is gradually miniaturized, aninterval between the plurality of coil parts embedded in the coilelectronic component becomes narrow, and it maybe difficult to suppressthe harmful interference between the coil parts only by adjusting ashape and a position relationship of the coil parts.

Therefore, according to an exemplary embodiment, the non-magnetic film61 which is in contact with the first and second side surfaces S_(W1)and S_(W2) of the magnetic body 50 in the width W direction of themagnetic body 50 and is in contact with the first and second mainsurfaces S_(T1) and S_(T2) of the magnetic body 50 opposing each otherin the thickness T direction of the magnetic body 50 is formed betweenthe first and second coil parts 41 and 42, and thus the harmful mutualinterference of the magnetic flux occurring from the plurality of coilparts may be suppressed.

The non-magnetic film 61 may be formed of any material without beingparticularly limited as long as the material may suppress the harmfulmutual interference of the magnetic flux occurring from the first andsecond coil parts 41 and 42, and may be formed of a material differentfrom that forming the magnetic body 50.

The material different from that forming the magnetic body 50 mayinclude the same material as that forming the magnetic body 50, but acomposition thereof is different.

For example, the non-magnetic film 61 may include glass.

Further, the non-magnetic film 61 may include any one or more selectedfrom the group consisting of a thermosetting resin, a metallic magneticpowder, a ferrite, and a dielectric, but is not limited thereto.

The non-magnetic film 61 may have permeability lower than that of themagnetic body 50. Therefore, the harmful mutual interference of themagnetic flux occurring from the first and second coil parts 41 and 42may be suppressed.

The first and second coil parts 41 and 42 may be connected to the firstto fourth external electrodes 81, 82, 83, and 84 disposed on the outersurfaces of the magnetic body 50 to be electrically connected thereto.

The first to fourth external electrodes 81, 82, 83, and 84 may be formedon the side surfaces S_(W1) and S_(W2) of the magnetic body 50 in thewidth direction of the magnetic body 50, and may be formed to beextended to the first and second main surfaces S_(T1) and S_(T2) of themagnetic body 50 in the thickness T direction of the magnetic body 50.

The first to fourth external electrodes 81, 82, 83, and 84 may bedisposed to be spaced apart from each other, and may be electricallyseparated from each other.

The first to fourth external electrodes 81, 82, 83, and 84 may be formedof a metal having excellent electrical conductivity, and may be formedof, for example, silver (Ag), palladium (Pd), aluminum (Al), nickel(Ni), titanium (Ti), gold (Au), copper (Cu), platinum (Pt), alloysthereof, or the like.

FIG. 3A is an inner projection plan view when being viewed from adirection A of FIG. 2, and FIG. 3B is an inner projection plan view whenbeing viewed from direction of B of FIG. 2.

Referring to FIG. 3A, the first and second coil parts 41 and 42 may beformed by extending an end portion of each of the first coil conductors43 and 45, and may include first lead parts 43′ and 45′ exposed to thefirst side surface S_(W1) of the magnetic body 50 in the width directionof the magnetic body 50, and second lead parts (not illustrated) formedby extending an end portion of each of the second coil conductors 44 and46 and exposed to the second side surface S_(W2) of the magnetic body 50in the width direction of the magnetic body 50.

The first lead parts 43′ and 45′ may be connected to the first andsecond external electrodes 81 and 82 disposed on the first side surfaceS_(W1) of the magnetic body 50 in the width direction of the magneticbody, and the second lead parts (not illustrated) may be connected tothe third and fourth external electrodes 83 and 84 disposed on thesecond side surface S_(W2) of the magnetic body 50 in the widthdirection of the magnetic body 50.

The first and second external electrodes 81 and 82 may be inputterminals, and the third and fourth external electrodes 83 and 84 may beoutput terminals, but are not limited thereto.

For example, a current input from the first external electrode 81, whichis an input terminal, may flow into the third external electrode 83,which is an output terminal, through the first coil conductor 43 of thefirst coil part 41, the via, and the second coil conductor 44 of thefirst coil part 41.

Similarly, a current input from the second external electrode 82, whichis the input terminal, may flow into the fourth external electrode 84,which is the output terminal, through the first coil conductor 45 of thesecond coil part 42, the via, and the second coil conductor 46 of thesecond coil part 42.

The non-magnetic film 61 may be disposed while being in contact with thefirst and second side surfaces S_(W1) and S_(W2) of the magnetic body 50in the width W direction of the magnetic body 50.

A thickness of the non-magnetic film 61 is not particularly limited, andmutual interference between the first and second coil parts 41 and 42may be adjusted and a coupling value may be controlled by adjusting thethickness of the non-magnetic film 61.

Referring to FIG. 3B, the non-magnetic film 61 may be formed to be incontact with the first and second main surfaces S_(T1) and S_(T2) of themagnetic body 50 in the thickness T direction of the magnetic body 50.That is, the non-magnetic film 61 may be formed to have the same heightas the thickness T of the magnetic body 50.

FIG. 4 is a cross-sectional view taken along line I-I′ of FIG. 1.

Referring to FIG. 4, the first and second coil conductors 43 and 45disposed on the first surface of each of the substrates 21 and 22, andthe second coil conductors 44 and 46 disposed on the second surface ofeach of the substrates 21 and 22 may be connected by the vias 48 and 49penetrating through the substrates 21 and 22.

The non-magnetic film 61 disposed between the first and second coilparts 41 and 42 may be formed while being in contact with the first andsecond side surfaces S_(W1) and S_(W2) of the magnetic body 50 in thewidth direction of the magnetic body 50.

The mutual interference between the first and second coil parts 41 and42 may be adjusted, and the coupling value may be controlled byvariously changing a height, an interval, a material, or the like of thenon-magnetic film 61.

FIG. 5A is a view illustrating magnetic flux formed in a coil electroniccomponent in which a non-magnetic film is not disposed, according to therelated art, and FIG. 5B is a view illustrating magnetic flux formed ina coil electronic component according to an exemplary embodiment in thepresent disclosure.

Referring to FIG. 5A, in a case of a coil electronic component in whichthe non-magnetic film is not disposed, mutual interference of magneticflux between the first and second coil parts 41 and 42 may occur.

Conversely, referring to FIG. 5B, by disposing the non-magnetic film 61between the first and second coil parts 41 and 42, the mutualinterference of the magnetic flux between the first and second coilparts 41 and 42 may be suppressed.

FIG. 6 is a plan view illustrating a pattern shape of coil parts of thecoil electronic component of FIG. 1.

Referring to FIG. 6, in the coil electronic component according to anexemplary embodiment, according to a method of forming the first andsecond coil parts 41 and 42, the non-magnetic film 61, and the magneticbody 50, coil conductor patterns 43″, 44″, 45″, and 46″ which become thefirst and second coil conductors 43, 44, 45, and 46 may be formed on thesubstrate by performing plating, and non-magnetic film patterns 61′ maybe formed between the first coil conductors and the second coilconductors.

Further, cover regions disposed on upper and lower portions of the firstand second coil parts 41 and 42 may be formed by stacking magneticsheets 50′ forming the magnetic body 50. Here, the non-magnetic filmpatterns 61′ formed between the first coil conductors and the secondcoil conductors may be formed on central regions of the magnetic sheets50′.

Next, the magnetic body 50 may be formed by the coil parts formed byconnecting the coil conductors disposed on one surface and the othersurface of the substrate and the magnetic sheets 50′ stacked on upperand lower portions of the coil parts. Here, the non-magnetic filmpatterns 61′ may be disposed between the first and second coil parts 41and 42 to form the non-magnetic film 61, thereby implementing the coilelectronic component according to an exemplary embodiment.

According to another exemplary embodiment, a coil electronic componentmay include a magnetic body in which coil parts formed by connectingcoil conductors disposed on one surface and the other surface of asubstrate are embedded, wherein the magnetic body may include first andsecond coil parts disposed to be spaced apart from each other, and mayinclude a gap part disposed between the first and second coil parts andsuppressing mutual interference of magnetic flux occurring from thefirst and second coil parts.

Board for Mounting Coil Electronic Component

FIG. 7 is a perspective view illustrating a figure in which the coilelectronic component of FIG. 1 is mounted on a printed circuit board(PCB).

Referring to FIG. 7, a board 200 for mounting a coil component 100according to an exemplary embodiment may include a printed circuit board210 on which the coil component 100 is mounted, and a plurality ofelectrode pads 220 formed on an upper surface of the printed circuitboard 210 to be spaced apart from each other.

In this case, the coil electronic component 100 may be soldered by asolder 230 to be electrically connected to the printed circuit board 210in a state in which first to fourth external electrodes 81, 82, 83 and84 disposed on outer surfaces of the coil electronic component 100 areeach disposed on the electrode pads 220 to be in contact with eachother.

Except for the above-mentioned description, a description of featuresoverlapping those of the coil electronic component according to theexemplary embodiment described above will be omitted.

As set forth above, according to exemplary embodiments in the presentdisclosure, the harmful mutual interference of the magnetic fluxoccurring from the plurality of coil parts disposed in the coil may besuppressed.

Further, the coupling value may be controlled by adjusting the mutualinterference between the coil parts.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A coil electronic component comprising: amagnetic body including first and second coil parts spaced apart fromeach other, wherein the coil parts each include first and second coilconductors respectively disposed on first and second surfaces of asubstrate, and a non-magnetic film disposed between the first and secondcoil parts.
 2. The coil electronic component of claim 1, wherein thenon-magnetic film includes glass.
 3. The coil electronic component ofclaim 2, wherein the glass is dispersed in the non-magnetic film.
 4. Thecoil electronic component of claim 1, wherein the non-magnetic film haspermeability lower than that of the magnetic body.
 5. The coilelectronic component of claim 1, wherein the first and second coil partseach include first and second lead parts respectively exposed to firstand second side surfaces of the magnetic body in a width direction ofthe magnetic body, and the first lead parts are connected to first andsecond external electrodes disposed on the first side surface of themagnetic body, and the second lead parts are connected to third andfourth external electrodes disposed on the second side surface of themagnetic body.
 6. The coil electronic component of claim 5, wherein thefirst and second external electrodes are input terminals, and the thirdand fourth external electrodes are output terminals.
 7. The coilelectronic component of claim 1, wherein the magnetic body includes amagnetic metallic powder dispersed in a thermosetting resin.
 8. The coilelectronic component of claim 1, wherein the first and second coilconductors are coated with an insulating layer.
 9. The coil electroniccomponent of claim 1, wherein the non-magnetic film includes any one ormore selected from the group consisting of a thermosetting resin, ametallic magnetic powder, a ferrite, and a dielectric.
 10. A coilelectronic component comprising: a magnetic body including first andsecond coil parts spaced apart from each other, wherein the coil partseach include first and second coil conductors respectively disposed onfirst and second surfaces of a substrate, and a gap part disposedbetween the first and second coil parts, and suppressing mutualinterference of magnetic flux occurring from the first and second coilparts.
 11. The coil electronic component of claim 10, wherein the gappart includes glass.
 12. The coil electronic component of claim 10,wherein the gap part has permeability lower than that of the magneticbody.
 13. The coil electronic component of claim 10, wherein the firstand second coil parts each include first and second lead partsrespectively exposed to first and second side surfaces of the magneticbody in a width direction of the magnetic body, and the first lead partsare connected to first and second external electrodes disposed on thefirst side surface of the magnetic body, and the second lead parts areconnected to third and fourth external electrodes disposed on the secondside surface of the magnetic body.
 14. The coil electronic component ofclaim 13, wherein the first and second external electrodes are inputterminals, and the third and fourth external electrodes are outputterminals.
 15. A board having a coil electronic component comprising: acircuit board including first to fourth electrode pads; and the coilelectronic component of claim 5 mounted on the circuit board so that thefirst to fourth external electrodes are disposed on the first to fourthelectrode pads, respectively.
 16. A board having a coil electroniccomponent comprising: a circuit board including first to fourthelectrode pads; and the coil electronic component of claim 13 mounted onthe circuit board so that the first to fourth external electrodes aredisposed on the first to fourth electrode pads, respectively.